Mold Release

S00303 12OZ MOLD RELEASE FOODGRAD SILICONE SPRAYN

Applications

Model #S00303

• For use with polystyrenes, polypropylenes, nylon, rubber, foams, metals, filament windings, polyurethanes, epoxy potting and encapsulating and phenolic resins.

Model #S00312

• Excellent for thermosetting and thermoplastic applications.
• For use with clear styrenes and acrylics, polystyrenes, reflex lenses, polysulfonates, polypropylenes, plastic molds, polycarbonates and molding ceramics.
• Will not interfere with post finishing operations such as painting, plating, stenciling, hot stamping or glueing.

Features

Model #S00303

• Non-silicone mold release.
• Exceptional anti-stick properties that will not transfer to finished parts, allowing for multiple releases per application.
• Compatible with most moldable resins, elastomeric compounds, urethanes and styrenes.
• Won't attach rubber, paints or metals.
• Won't interfere with post-finishing operations.
• Recommended for low and high-temperature molds up to 575°F.

Model #S00312

• High-grade, finely milled, dry zinc-powder release agent is effective up to 450°F (232°C).
• Gobbing and hot spots are controlled, reducing rejected parts.
• Does not contain not contain any chlorofluorocarbons (CFC’s) or hydrochlorofluorocarbons (HCFC’s).